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MTI

Silicon Nitride Film

Silicon Nitride Film

Sizes and Specifications

1. 100 nm Silicon Nitride Film (PE-CVD) on Si(100)P-type B-doped 100 mm dia .x0.525mm thick 1sp R:0.001-0.005 ohm.cm

Silicon Nitride Film

  • Si3N4 Film coated by low stress PE-CVD method
  • Si3N4 Thickness:   100nm  +/- 8%
  • Si3N4 covers front polished side of Silicon wafer ONLY
  • Refractive Index of Si3N3: 1.98 +/-0.05 @ 632.8nm

Silicon Wafer Specifications:

  • Conductive type:        Si   P- type, B-doped
  • Resistivity:                 0.001-0.005 ohm-cm
  • Size:                          4" diameter +/- 0.5 mm x  0.525 +/- 0.025 mm th
  • Orientation:                (100) +/- 0.5o
  • Polish:                        One  side  polished
  • Surface roughness:     Prime
  • Packing:                      Vacuum packed on a 4" single wafer carrier box

 

 

2. 1000 nm Silicon Nitride Film (LPCVD) on Si(100) P-type, B-doped 100 mm dia .x0.525mm thick 1sp R:1-20 ohm.cm

Silicon Nitride Film

  • Si3N4 Film coated by low stress LPCVD method
  • Si3N4 Thickness:1000 nm  +/- 10%
  • Si3N4 covers both sides of Silicon wafer
  • Refractive Index of Si3N4: 1.95 - 2.05

Silicon Wafer Specifications:

  • Conductive type:        Si   P- type, B-doped
  • Resistivity:                 1-20 ohm-cm
  • Size:                          4" diameter +/- 0.5 mm x  0.525 +/- 0.025 mm th
  • Orientation:                (100) +/- 0.5o
  • Polish:                        One  side  polished
  • Surface roughness:     Prime
  • Packing:                      Vacuum packed on a 4" single wafer carrier box

 

 

3. 300 nm Silicon Nitride Film (LPCVD) on Si(100) N-type P-doped 100 mm dia .x0.525mm thick 1sp R:1-20 ohm.cm

Silicon Nitride Film

  • Si3N4 Film coated by low stress LPCVD method
  • Si3N4 Thickness:   300 nm  +/- 10%
  • Si3N4 covers both sides of Silicon wafer
  • Refractive Index of Si3N4: 1.95 - 2.05

Silicon Wafer Specifications:

  • Conductive type:        Si   N- type, P-doped
  • Resistivity:                 1-20 ohm-cm
  • Size:                          4" diameter +/- 0.5 mm x  0.525 +/- 0.025 mm th
  • Orientation:                (100) +/- 0.5o
  • Polish:                        One  side  polished
  • Surface roughness:     Prime
  • Packing:                      Vacuum packed on a 4" single wafer carrier box
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